Close Out and Final Report for NASA Glenn Cooperative Agreement NCC3-867 Packaging Technology for S ic High Temperature Circuits Operable up to 500 "C OAI-02-043

A parametric study of the thermomechanical reliability of a Au thick-film based Sic-dieattach assembly using nonlinear finite element analysis (FEA) was conducted to optimize the die-attach thermo-mechanical performance for operation at temperatures from room temperature to 500 "C. This parametric study centered on material selection, structure design and process control. The die-attach assembly is composed of a 1 mm x 1 mm S i c die attached to a ceramic substrate (either 96% aluminum oxide (A1203) or aluminum nitride (AlN)) with a gold (Au) thick-film attach layer. The effects of die-size, Au attach layer thickness, substrate material, and stress relaxing temperature on the stress/strain distribution and relative fatigue lifetime of the die-attach assembly were numerically analyzed. By comparing the calculated permanent strain in the thick-film attach layer, FEA results indicate that AlN is superior to Al2O3. Thicker Au attach layers and smaller die sizes are recommended to reduce the permanent strain in thick-film die attach layer. Thicker S i c die also reduces the stress near the (top) surface region of the die. A stress relaxing temperature close to the midpoint of the operating temperature range further reduces the maximum stress/strain, thereby improving die-attach thermo-mechanical reliability. These recommendations present guidelines to optimize the thermo-mechanical performance of the die-attach assembly and are valid for a wide range of thermal environments. P